Diamond Slice is electrochemically produced diamond slices. Slicing layer containing diamond abrasive grains, metal bond diamond abrasive is bonded to the substrate. First deposition thickness of the metal binding agent for the height of diamond abrasive grains 20% (on the sand), and then continue with a metal bond diamond abrasive grains bonded to (thickening), a thickness of about 2/3 of the height of the abrasive grains. Including diamond dressing sliced, grinding or cutting with diamond chips. Diamond Slice advantages: ① without dressing, easy to use; ② single-layer structure determines that it can achieve high-speed operation; ③ Although only a single layer of diamond, but there is still enough life; ④ For high precision wheel slice, electroplating unique manufacturing method. Precisely because of these advantages, plating slice high-speed, ultra-high speed grinding occupy the undisputed dominant position. Slice synthetic diamond powder electrolytic nickel flat shape. Mainly used for hard and brittle non-metallic materials, such as optical glass, ceramics, ferrites, precious stones, stone and other cutting grinding process, but also for electrolysis grinding carbide products. Use convenient, welcomed the purchase, product classification can be divided into user version and business version. User version is simple newspaper packaging (ie excluding bags) user version can be subtracted bags cost more affordable. Hotline: 0555-6766695 Fax: 0555-6767472 Mobile: 13955581161 QQ: 1014854104 Company official website: www.dcyjp.com